Call for Abstracts - Divisions & Groups


Advanced Surface Engineering (SE)

The program of the Advanced Surface Engineering Division (SE) focuses on all topics related to intentionally enhancing or changing the properties and functionalities of surfaces of all kinds. Both fundamental scientific and application-oriented contributions presenting results from experiments or from modelling or simulation are welcome. The session “Plasma-assisted Surface Modification and Deposition Processes” invites contributions aiming for understanding or further developing techniques and processes to alter the appearance of surfaces or to synthesis thin films and coatings on surfaces of interest. Topics related to analysis and characterisation of such modified surfaces will be covered by the session “Nanostructured Thin Films and Coatings.” This includes also contributions on new and advanced characterisation techniques in order to gain further details. A frequent application of coatings is to protect the underlying surface from environmental influences. The session “Wear, Oxidation and Corrosion Protective Coatings” will deal with all different kinds of protective coatings in academic research, but also in industrial and ‘real-world’ applications. Last but not least the session “New Challenges and Opportunities in Surface Engineering” will serve as a forum to gather new ideas and developments in the field and to shows its broadness. The main focus will be on topics and contributions that show how surface engineering can assist to solve present-day and future problems. Invited lectures will review and highlight the state-of-the-art and latest findings in various topics. Academics, scientists, technicians and especially young students and Ph.D. students from various disciplines and all countries are invited to contribute to a technical program of big diversity, that will offer large benefits for everybody when joining friends and colleagues with outstanding expertise in many areas in a very family atmosphere at the occasion of AVS 65 in sunny Long Beach, California, in 2018.

SE1+PS  Plasma-assisted Surface Modification and Deposition Processes
  • Diederik Depla, Ghent University, Belgium, "Dedicated Experiments to Challenge a Model for Reactive Magnetron Sputtering"
SE2+NS+TF  Nanostructured Thin Films and Coatings
  • Hanna Kindlund, Lund University, Sweden, "Toughness Enhancement in Hard Single-crystal Transition-metal Nitrides: V-Mo-N and V-W-N Alloys"
SE3 Wear, Oxidation and Corrosion Protective Coatings
  • Ali Erdemir, Argonne National Laboratory, "In-Operando Formation of Carbon-based Tribofilms on Catalytically Active Nanocomposite Coatings"
  • Frederic Sanchette, Université de Technologie de Troyes, France, "Corrosion Resistance of Mechanically Reinforced Aluminium-based Coatings obtained by PVD Techniques"
SE4 New Challenges and Opportunities in Surface Engineering
  • Jinn Chu, National Taiwan University of Science and Technology, Taiwan, Republic of China, "Metallic-Glass Nanotube Arrays: A New and Novel Devices for Various Applications"
  • Ludvik Martinu, Ecole Polytechnique de Montreal, Canada, "From Passive to Active Optical Coatings - Challenges and Opportunities for Pulsed Plasma Deposition Processes"
SE5 Advanced Surface Engineering Division Poster Session

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Applied Surface Science (AS)

The Applied Surface Science Division (AS) provides a forum for research in the preparation, modification, characterization, and utilization of surfaces in practical applications.  Areas of interest range from nanoscience, polymers, and semiconductor processing to forensic science and biotechnology.  The Division has long been the premier gathering place for the global surface and near surface analysis community, with concentrations in techniques such as SIMS, XPS/Auger spectroscopies, Atom Probe Tomography and methods. Included are presentations representing a mixture of cutting-edge applications and the fundamentals supporting the measurement science. We also encourage contributions from nontraditional techniques such as Atom Probe Tomography.  The Division is constantly striving to provide a forum for current and mature interests (with sessions such as Quantitative Surface Analysis and Practical Surface Analysis) while identifying key areas for future development.  Several special sessions this year are designed to showcase our connection to the Internet of Things.  Two sessions this year celebrate the impact of Nick Winograd and Barbara Garrison of the Pennsylvania State University, to this Division. Contributions are welcome from any research associated with the session titles.
AS1 Quantitative Surface Analysis
  • Alexander Shard, National Physical Laboratory, UK, "A Fistful of Data: The Good, the Bad and the Ugly of Quantitative Surface Analysis"
AS2 Multitechnique Applications-When More techniques are Better than One
  • José Cerrato, University of New Mexico, "Integration of Laboratory Experiments. Spectroscopy, and Microscopy to Investigate the Reactivity of Metals in Mine Wastes"
AS3+BI  Applied Surface Science: From Electrochemistry to Cell Imaging, a celebration of the Career of Nicholas Winograd
  • Nicholas Lockyer, University of Manchester, UK, United Kingdom of Great Britain and Northern Ireland, "Surface Analysis and Beyond, Using Ions Beams and Lasers"
  • Christopher Szakal, National Institute of Standards and Technology, "Pushing the Limits of Measurement Science with SIMS"
AS4 The Impact of Modeling (Ion, Electron) and Data Analysis on Applied Surface Science, a Celebration of the Career of Barbara Garrison
  • Arnaud Delcorte, Université Catholique de Louvain, Belgium, "Collective Action, the Key to Soft Molecule Desorption under Particle Bombardment"
  • Zbigniew Postawa, Jagiellonian University, Krakow, Poland, "Computer Modeling of Cluster Projectile Impacts for SIMS Applications"
AS5+NS+SA  Beyond Traditional Surface Analysis
  • Shelley Claridge, Purdue University, "Reenvisioning Amphiphilicity: Translating Cell Membrane Design Principles to Synthetic 2D Materials"
AS6+SE  Industrial and Practical Applications of Surface Analysis
  • Steven Pachuta, 3MTS, " Problem Solving with Valence Band Spectroscopy and SIMS MS/MS"
AS7+SE  Applied Surface Analysis of Novel, Complex or Challenging Materials
  • John Kilner, Imperial College London, UK, United Kingdom of Great Britain and Northern Ireland, “Understanding the Surface of Complex Oxides used in High Temperature Electrochemical Devices"
AS8+NS  Profiling, Imaging and Other Multidimensional Pursuits
  • Austin Akey, Harvard University, "Atom Probe Tomography"
AS9 Applied Surface Science Division Poster Session

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Biomaterial Interfaces (BI)

The Biomaterials Interfaces Division program begins with the traditional Sunday afternoon Plenary Session with presentations by top scientists in biomaterials and bio-related research. The BI program will then continue with a series of sessions throughout the week to provide an interdisciplinary forum for the presentation and discussion of fundamental aspects of bio-interface science and engineering. The BI program brings together recent advances made in materials science and molecular biology with sophisticated surface and interface analysis methods, and theoretical and modeling approaches for biological systems. This year the BI division is cosponsoring the Industrial Physics Forum (IPF) with the American Institute of Physics. The IPF will showcase exciting, upcoming fields of interest related to biosciences including imaging, sensing, diagnostics, and biomaterial assembly. The IPF will complement our BI sessions with invited speakers representing the leaders in these fields.  We invite you to take part in this exciting program by submitting your abstract to one of our BI sessions. Areas of interest are: Microbes and Fouling at Surfaces, including  control of microbes and fouling, biofilms, biofouling, attachment and adhesion of microbes, assessment of antifouling and fouling release function, antifouling coatings, motility at interfaces, colonization analysis, biofilms and EPS; Biomolecules and Biophysics at Interfaces, including proteins at  surfaces, nucleic acids, polysaccharides, adsorption, blood-contacting materials, bioadhesion, and  infection and immunity; Characterization of Biological and Biomaterials Surfaces, including spectroscopy, imaging, microscopy, optical and mechanical methods of thin film analysis, characterization in biological media, quantification, chemometrics, microfluidics, time- and spatial resolution measurements, and scanning probe techniques; Bioanalytics, Biosensors and Diagnostics, including biological membranes, vesicles, membrane processes, forces, recognition, signaling, biosensors, microfluidics, point-of-care devices, paper based sensors, and electrochemistry; Biomaterials and Nanomaterials fabrication, including organic thin films, polymer coatings, hybrid coatings, biologically inspired materials, plasma produced biomaterials, patterning, nanofabrication, rapid prototyping, additive manufacturing, 3D structures, tissue formation, implant integration, artificial organs, 3D biofilm structures; Advanced 3D Imaging of Biological Materials, 3D chemical analysis, 3D tomographic analysis, microscopy, 3D tracking. The BI division is also hosting a special session to honor the contributions of Women in Bio-surface Science. We also invite submissions of Flash/Poster Presentations, to be made in a dedicated session with an accompanying Networking Session involving associated poster presentations. Joint BID/Biointerphases prizes will be awarded for the best student Flash/ Poster presentations. 

BI1+AS+IPF+NS  Advanced Imaging and Structure Determination of Biomaterials Research

BI2+IPF+MN  Bioanalytics, Biosensors  and Diagnostics

BI3+IPF+MN+NS  Biofabrication: from Tissue to Organ

BI4+AS+NS  Characterization of Biological and Biomaterial Surfaces
  • David Scurr, University of Nottingham, UK, United Kingdom of Great Britain and Northern Ireland, “Novel Insights into Skin Biology and Permeation of Actives using ToF-SIMS and 3D OrbiSIMS”
BI5  Biomolecules and Biophysics at Interfaces
  • Ximin He, UCLA
BI6  Microbes and Fouling at Surfaces
  • Kenan Fears, US Naval Research Laboratory, "Unraveling Complexities at the Adhesive Interface of Acorn Barnacles"
BI7  Women in Bio-surface Science
  • Kelly Nash, University of Texas at San Antonio
BI8  Biolubrication and Wear
  • Xavier Banquy, University of Montreal, Canada, “Superlubricating Fluids: Bioinspired Solutions and Medical Applications”
BI9  Biomaterial Interfaces Division Flash Poster Session

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Electronic Materials & Photonics (EM)

The Electronic Materials and Photonics Division (EM) encompasses the science and engineering of materials, interfaces, and processing that advance electronic, photonic or optoelectronic device technologies. The EMPD program for AVS 65 will include: (1) Flexible Electronics, (2) CMOS, Beyond the Roadmap and Over the Cliff, (3) Selective-Area Patterning (Assembly/Deposition/Etching), (4) Surface and Interface Challenges in Electronics and Photonics, including tailoring surfaces and characterization of surfaces and interfaces, (5) Wide and Ultra-Wide Band Gap Materials for Electronic Devices: Growth, Modeling, and Properties, (6) Nanostructures for Electronic and Photonic Devices, (7) Quantum Materials and Applications, including quantum sensing, communication and computing, (8) 2D Crystal Applications, including, but not limited to sensors, light and power sources,  and (9) 3-2-1 Contacts, including, but not limited to, material and electrical characterization of contacts, non-traditional materials for contacts such as transparent conducting electrodes, contact stability and reliability, and contacts for challenging systems including 2D materials, wide band-gap semiconductors, and nanowires.

EM1+2D+NS+PS+RM+TF  Flexible Electronics
  • Jay Switzer, Missouri University of Science and Technology, "Epitaxial Electrodeposition of Electronic and Photonic Materials onto Wafer-size Single Crystal Gold Foils for Flexible Electronics"
EM2+MP+PS  CMOS, Beyond the Roadmap and Over the Cliff
  • Iuliana Radu, IMEC, Belgium
EM3+AM+NS+PS  Selective-Area Patterning (Assembly/Deposition/Etching)
  • Robert Clark, TEL Technology Center, America, LLC
  • James Engstrom, Cornell University, “Competitive Adsorption as a Route to Area Selective Deposition”
EM4+AN+MI+SS  Surface and Interface Challenges in Electronics and Photonics
  • Parag Banerjee, Washington University in St. Louis
EM5+2D+SS  Wide and Ultra-Wide Bandgap Materials for Electronic Devices: Growth, Modeling and Properties
  • Srabanti Chowdhury, UC Davis
EM6+MI+MN+NS  Nanostructures for Electronic and Photonic Devices
  • Maiken Mikkelsen, Duke University
EM7+2D+AN+MI+MP+NS  Quantum Materials and Applications
  • Jelena Vuckovic, Stanford University
EM8+2D+NS+SS  2D Crystal Applications
  • Dirk Englund, MIT
EM9+NS+PS  3-2-1 Contacts: Electronic Contacts and Related Issues in Device Fabrication
  • Suzanne Mohney, The Pennsylvania State University, "The Effect of Metal Diffusion on Contacts to Semiconducting Chalcogenides: Examples in 2D and 3D"
EM10+TF  Solar/Energy Harvesting
  • Deirdre O'Carroll, Rutgers, the State University of New Jersey, "Plasmonic Metasurface Electrodes for Excitonic Solar Cells"
EM11+2D+NS+SS  Photonics in 2D Materials
  • James Schuck, Columbia University, “Nano-optical Activation of Defect-bound Excitons in Monolayer WSe2 towards Room-temperature 2D Single-photon Optoelectronics”
EM12   Electronic Materials and Photonics Division Poster Session

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Magnetic Interfaces & Nanostructures (MI)

This years’ MI program will cover a wide area of topics ranging from chiral magnetism over magnetism and spin orbit effects at interfaces to magnetism in organic system. The focus of the program is to cover areas of magnetism that are fascinating from a fundamental point of view but which carry significance for future applications. In detail, the MI program will feature pioneering, controversial, introductory and emerging results in topical areas related to magnetic interfaces and nanostructures. In addition it highlights the synergy of our division with other groups within the AVS by featuring magnetic systems that rely on atomic control of surfaces and interfaces. Topics include: (1) Spin-orbit Coupling at Surfaces and Interfaces (2); Role of Chirality in Spin Transport and Magnetism; (3) Controlling Magnetism in Oxides and Multiferroics and (4) Novel Magnetic Phenomena at Interfaces and (5) Magnetic Nanoparticles in Life Sciences. In 2018 we would like to especially focus on the synergy between the research areas covered by MI and their role for the development of new materials and devices for the information society. For this reason the program will feature a special symposium. Also, the Magnetic Interfaces and Nanostructures Division will be selecting the best graduate student presentation from finalists for the Leo Falicov Award. MI will also offer an award for postdoctoral fellows who will be presenting papers at this International Symposium. The winners of both awards will be announced towards the end of the meeting.

MI1+EM  Spin-Orbit Coupling at Surfaces and Interfaces
  • Carlos Rojas-Sanchez, University of Lorraine, France, "Interfacial Spin-Orbitronics: Spin-Charge Conversion in Topological Insulators and Rashba Interfaces"
MI2+SA  Controlling Magnetism in Oxides and Multiferroics
  • Yayoi Takamura, University of California, Davis
  • Evgeny Tsymbal, University of Nebraska-Lincoln, "Control of Magnetism at the Antiperovskite/Perovskite Interface"
MI3+2D  Novel Magnetic Phenomena at Interfaces
  • Dirk Sander, Max Planck Institute, Halle, "New Insights into Nanomagnetism by Spin-STM"
  • Jiabao Yi, The University of New South Wales, Australia, "Ferromagnetism in 2D Materials"
MI4 Role of Chirality in Spin Transport and Magnetism
  • Eric Fullerton, University of California at San Diego, "Materials Optimization to Form Skyrmions and Skyrmion Lattices"
  • Ron Naamen, Weizmann Institute, Israel, "Chiral Induced Spin Selectivity"
MI5+BI  Magnetic Nanoparticles in Life Sciences
  • Kannan Krishnan University of Washington
  • Elena Rozhkova, Argonne National Laboratory
MI6+2D+EM+NS  Materials and Devices for the Information Society
  • Andrew Kent, New York University/STT, "Physics and Applications of Spin-transfer Torques"
  • Shriram Ramanathan, Purdue University, “Organismic Materials and Intelligence”
  • Ivan Schuller, University of California, San Diego
  • Roger Wood, Western Digital, “Magnetic Devices and the Story of "Factors of Ten"”
MI7 Magnetic Interfaces and Nanostructures Division Poster Session

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The MEMS and NEMS Technology Group (MN) program will highlight recent advances in the broad areas of micro/nanoelectromechanical systems (MEMS/NEMS), especially latest fundamental studies of novel materials, processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas. This AVS65 MN program will include a focus on sensing, communication, and energy scavenging for internet of things(IoT).  Another highlight will be multiscale manufacturing of systems including microfluidics systems and bioMEMS with applications to chemical analytics and healthcare. Our program will include resonant low-dimensional materials and parametric and nonlinear MEMS/NEMS resonators which create intriguing possibilities of integrating these devices with existing fluidic, electronic and optical on-chip networks. The program continues to embrace latest progresses in optical MEMS/ NEMS, micro/nanophotonics, optomechanics, quantum MEMS/ NEMS, resonant systems, CMOS-MEMS, mesoscopic dynamics and dissipation processes, inertial sensors, harsh-environment transducers, and MEMS/NEMS-enabled energy technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS for biosensing, bio-inspired microsystems, wearable and wireless healthcare. 

MN1+NS+PS  Multiscale Manufacturing: Enabling Materials and Processes
  • Bernard Legrand, Centre  National de la Recherche Scientifique (CNRS), France, “MEMS-based Atomic Force Microscopy Probes: From Electromechanical to Optomechanical Vibrating Sensors”
  • Greg Nordin, Brigham Young University, "Miniaturizing 3D Printed Microfluidics: State-of-the-Art and Outlook"
MN2+2D+AN+MP+NS Information Processing and Optomechanics
  • John Davis, University of Alberta, Canada, “Towards Microwave to Telecom Wavelength Quantum Information Transfer using Cavity Optomechanics”
  • Eva Weig, University of Konstanz, Germany, "Nonlinear Dynamics of Single and Strongly Coupled High Q Resonator Modes"
MN3+2D+AN+NS  Nonlinear Effects and Devices
  • Eyal Buks, Israel institute of technology, Israel, "Back-reaction Effects in Opto-mechanical Cavities"
  • Daniel Lopez, Argonne National Lab, "Embracing Nonlinear Dynamics in Micro and Nanomechanical Systems"
  • Canan Dagdeviren, MIT
  • Yu-Chong Tai, California Institute of Technology, "BioMEMS for Eye Applications"
MN5+2D+AN+NS  MEMS for IoT: Sensing, Communication, and Energy Scavenging
  • Oliver Brand, Georgia Institute of Technology, "MEMS-based Resonant Sensors"
  • Rob Candler, UCLA, "Magnetic Microsystems for Communications"
  • Guang-Wei Deng, University of Science and Technology of China, China, "1D/2D NEMS Quantum Information Processing"
  • Yuehang Xu, University of Electronic Science and Technology of China, "Characterization and Modeling of a Radio Frequency Graphene Resonant Channel Transistor"
MN7     MEMS and NEMS Group Poster Session

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Manufacturing Science & Technology (MS)

This year's MS sessions listed below, are designed to highlight the challenges related to manufacturing for two cutting edge applications.  Our session on working with government labs and user facilities enables representatives  of these labs and user facilities to present the capabilities of their organizations and how the AVS attendees can work with them.

MS1+MI+RM  Challenges of Neuromorphic Computing and Memristor Manufacturing
  • Nate Cady, SUNY Polytechnic Institute, “Memristive Synapses – Tuning Memristors for Performance and CMOS Integration”
  • David Hughart, Sandia National Laboratories, “ReRAM – Fabrication, Characterization, and Radiation Effects”
  • Hsinyu Tsai, IBM Almaden Research Center
  • H.S. Philip Wong, Stanford University
MS2+MN  Challenges of Sensor Manufacturing for the IoT
  • Enid Kivuti, Multek Corp., "Enabling Smart and Connected Living through High Volume Roll to Roll Manufacturing"
  • Scott Miller, NextFlex, " Manufacturing Strategies for Flexible Hybrid Electronics"
  • Radislav Potyrailo, General Electric Global Research Center, " New Generation Chemical and Biological Sensors:  From New Ideas to Manufacturable Products"
MS3 Working with Government Labs and other User Facilities

MS4 Topics in Manufacturing Science and Technology Poster Session

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Nanometer-scale Science & Technology (NS)

At the most inclusive level, nanotechnology is anything that involves materials that have structure 100 nm or smaller.  Many of the most interesting areas of nanotechnology involve materials or systems whose properties change dramatically as they decrease in size from the bulk, or as surfaces become dominant. Nanoscience and Nanotechnology have become ubiquitous throughout the scientific community as can be attested by the multiple sessions addressing their different aspects at the AVS Symposium.
 At the NSTD sessions, researchers from around the globe will present their work on topics such as nanoscale devices and quantum systems, exploiting nanomaterials for applications in photonics, plasmonics, catalysis, surface chemistry, sensors, biomechanics, imaging, and energy, including nanoscale characterization and spectroscopy.

This year the program will highlight the following:
 (a)  A session focusing on the science and technology of oxides at the nanoscale; (b) Advances in fabrication and manufacturing at the nanoscale; (c) Recent developments in the characterization of materials at the nanometer scale, and recent advances in scanned probe microscopy; (d) Areas of convergence between nanotechnology and electrical, magnetic, mechanical, and optical devices and phenomena. (e) The program will also include a special session on the applications of nanotechnology in renewable energies.

NS1+AN+EM+MN+MP+RM  Experimental Nanoscale Optomechanical Quantum Systems
  • Krishna Balram, University of Bristol, UK, United Kingdom of Great Britain and Northern Ireland
NS2+2D+AN+EM+MN+MP+PC+RM  Nanostructured Devices and Sensors
  • Leonidas Ocola, IBM Research Division, T.J. Watson Research Center
NS3+AM+EM+MN+MP+RM  Nanophotonics, Plasmonics, and Metamaterials
  • Amit Agrawal, NIST
  • Amy Foster, Johns Hopkins University
NS4+AM+AN+EM+MI+MN+MP+PS+RM  Nanopatterning and Nanofabrication
  • James Liddle, NIST
NS5+AN+MN+PC  Nanoscale Biomedical Devices
  • Yann Astier, Roche Sequencing Solutions
NS6 Nanoscale Polymer Physics
  • Paul Nealy, University of Chicago, “Directed Self-assembly of Soft Materials on Chemically Nanopatterned Surfaces”
NS7+AN+MN+MP+TF+TR  Nanodiamond: Thin Films and Applications
  • Dean Ho, UCLA
NS8+2D+AN+MN+MP+SE  Nanomechanics
  • Hiroshi Yamaguchi, NTT, Japan, "Electron-Photon-Phonon Hybrid Systems Based on Compound Semiconductor Mechanical Resonators"
NS9+2D+AS+MN+PC  SPM – Probing Electronic and Transport Properties
  • Katja Nowack, Cornell University, "Imaging Current in Two-dimensional Quantum Materials"
NS10+2D+AS+PC  SPM - New Imaging and Spectroscopy Methodologies
  • Marina Leite, University of Maryland College Park, “Advances in SPM Methods for Energy-relevant Materials”
NS11+AS+MN+PC+PS+SS+TR  SPM – Probing Chemical Reactions at the Nanoscale
  • Michael F. Crommie, University of California at Berkeley
NS12+MM+SS+TR  SPM – Probe Sample Interactions
  • Reza Moheimani, UT Dallas, “A Connection Between Stability of STM Control System and Local Barrier Height: Implications on Imaging and Lithography”
NS13+AM+MI+MN+SS+TR  SPM – Probing and Manipulating Nanoscale Structures
  • Sven Rogge, University of New South Wales, Australia, “Building Artificial Quantum Matter with Dopant Atoms”
NS14+SS  SPM – Fast Scanning Techniques
  • Georg Fantner, EPFL, Switzerland, “Low-Force, High-Speed Atomic Force Microscopy using Photothermal Off-Resonance Tapping”
  • Chanmin Su, Bruker-Nano, Inc.
NS15+MN+PC+SS  SPM – Biological Applications of SPM
  • Uri Sivan, Technion Israel Institute of Technology, Israel
NS16    Nanometer-scale Science and Technology Division Poster Session

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Plasma Science & Technology (PS)

The Plasma Science & Technology Division program highlights state-of-the-art advances in plasma research, ranging from fundamental studies of plasma physics and chemistry to novel plasma processing applications to enable the IoT era.  Abstracts describing novel research are solicited in areas of multi-patterning for microelectronics fabrication, plasma etching and deposition, plasma modeling, plasma surface interactions, plasma sources, and plasma diagnostics, sensors and control.  We are also excited to announce, in collaboration with Thin Films Division, a new session track on Atomic Layer Processing (ALP), to highlight the synergy between ALD and ALE.  Abstracts are solicited on topics ranging from atomic layer etching (plasma or thermal), area selective deposition, chemistry and surface reactions for ALP and integration of ALD and ALE. Other relevant ALP topics also include area selective patterning, plasma-enhanced ALD, emerging applications, diagnostics and high volume manufacturing of ALP.  Other areas of interest are biomedical applications enabled by plasmas, atmospheric pressure plasmas and their applications (including discharges in liquids and/or multi-phase media.)  Sessions on plasma processing of challenging materials, III-V, II-VI, nanomaterials, and nanoparticles are also planned to highlight exciting research for various applications including IoT which features notably our 2018 Plasma Prize winner, Dr. Meyya Meyyappan.  In addition to the oral sessions, abstracts can be submitted to the poster session, which provides an excellent opportunity for one-on-one discussions of new results with colleagues.

PS1+EM  Advanced Patterning
  • Patricia Pimenta-Barros, CEA, LETI, MINATEC Campus, France, “Patterning Challenges and Solutions for Stacked-Nanowires Devices” 
PS2+EM  Advanced FEOL/Gate Etching
  • Takeshi Ohmori, Hitachi, Ltd., Japan, “Etching Recipe Optimization Using Machine Learning”
PS3+EM  Advanced BEOL/Interconnect Etching
  • Xiang Hu, GLOBALFOUNDRIES, "BEOL Etch Patterning Challenges for 14nm and beyond High Volume Manufacturing"
  • Ryukichi Shimizu, Tokyo Electron Limited, Japan, "Innovative Approach for Future Challenges in MOL/BEOL Etching"
PS4+EM+SE  Plasma Processing of Challenging Materials
  • Toshiaki Kato, Tohoku University, Japan, "Wafer-scale Fabrication and Growth Dynamics of Suspended Graphene Nanoribbon Arrays"
PS5+EM  Plasma Processing of III-V or II-VI Materials
  • Necmi Biyikli, University of Connecticut, “Self-limiting Growth of III-nitride Materials via Hollow-cathode Plasma-ALD: Structural and Chemical Analysis”
PS6+EM+NS+SS  Plasma Processing of Nanomaterials and Nanoparticles
  • Meyya Meyyappan, NASA Ames Research Center, "Low Temperature Plasmas in Nanotechnology Applications"
PS7+AS+EM+SS  Plasma-Surface Interactions
  • Thomas Morgan, DIFFER, The Netherlands
PS8 Plasma Sources
  • Hyo-Chang Lee, KRISS, Korea, Republic of Korea, “Hydrid Plasma Source with Inductive and Capacitive Fields: Fundamental Understanding and Nano-applications”
  • Gerard van Rooij, DIFFER, The Netherlands, "Microwave Plasma as Source for Vibrational Non-Equilibrium Flow Enabling Efficient Power-To-X Conversion"
PS9 Plasma Modeling
  • Tony Murphy, CSIRO, Australia
  • Yiting Zhang, Lam Research Corporation, "Understanding Aspects of Plasma Etching with 3D Profile Simulation"
PS10    Plasma Diagnostics, Sensors and Controls
  • Yi-Kang Pu, Tsinghua University, China, “The Surface Plasmon Energy and the Secondary Electron Emission on an Oxidized Aluminium Surface”
PS11+TF  Plasma Deposition and Plasma-Enhanced ALD
  • Luc Stafford, University of Montreal, Canada, “Deposition of Multifunctional, Nanostructured Coatings on Lignocellulosic Materials using Cold, Atmospheric-Pressure Plasmas”
PS12+PB+SE  Atmospheric Pressure Plasmas
  • Sylvain Coulombe, McGill University, Canada, "Plasma Sources for Energy Applications: The Quest for Higher Pressures"
  • Jacob Shelley, Rensselaer Polytechnic Institute
PS13+PB  Plasma Medicine
  • Vandana Miller, Drexel University, "Plasma Immunotherapy of Cancers"
PS14+MN  Enabling IoT Era
  • Subramanian Iyer, UCLA, "Moore's Law Ending? eAdvanced Packaging to the Rescue!"
  • Michael Seddon, ON Semi, “Use of Plasma in Advanced Packaging”
PS15    Plasma Science and Technology Division Poster Session

PS16+EM+TF  Atomic Layer Processing: Atomic Layer Etching
  • David Boris, Naval Research Laboratory
  • Noriaki Toyoda, University of Hyogo, Japan, "Irradiation Effects of Gas Cluster Ion Beams on Co–Fe Films"
  • Charles Winter, Wayne State University
PS17+EM+TF  Atomic Layer Processing: Integration of ALD and ALE
  • Mike Cooke, Oxford Instruments Plasma Technology, UK
  • Ben Rathsack, TEL Technology Center, America, LLC, “Selective Processing to Enable High Fidelity Control for the 5 nm Node”

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Surface Science (SS)

The Surface Science Division provides a forum for cutting-edge and foundational research that involves solid surfaces and interfaces. Phenomena that take place at the gas-solid and liquid-solid interfaces are prominent within the SS division programs. Technical sessions address atomistic, structural, electronic, and chemical phenomena at surfaces and interfaces, their impact on materials properties, and their implication for technological and catalytic processes. Surface chemistry is an important divisional theme, encompassing the kinetics and dynamics of surface processes and chemical events from adsorption and reaction to catalysis from both a theoretical and experimental perspective. Film and 2D nanostructure growth is another key theme, explored from a fundamental perspective, through the development of new growth and processing methods for materials preparation and novel materials like 2D metal organic frameworks. Lively sessions are devoted to the surface science of metallic, semiconductor, oxide, and organic surfaces that support unique chemical activity and electronic properties. Surface science applications in high-impact areas, including energy science, microelectronics, 2D materials and nanotechnology, - are highlighted in the program with a focus on bridging pressure gaps. This Division's overarching goal is to provide the atomistic insights on solid surfaces and interfaces needed to advance our understanding of materials systems and benefit society.
SS1+HC  Catalytic Alloys: Understanding Heterogeneity
  • Will Medlin,  University of Colorado, "Surface science-informed Design of Multicomponent Catalysts for Deoxygenation of Biomass Derivatives"
SS2+HC  Theory and Modeling of Surfaces and Reactions
  • Jean Sabin McEwen, Washington State University, "Elucidating the Chemical Nature of Single-Site Catalysts from First Principles"
SS3+HC+MI  Dynamical Processes at Surfaces
  • Wilson Ho, UC Irvine, University of California Irvine, "Light Driven Single Molecule Coherent Dynamics at Surfaces"
SS4+HC+MI  Oxides/Chalcogenides: Structures and Reactions
  • Melissa Hines, Cornell University , "New Eyes for Nanocatalysis: Atomic Scale Investigations of TiO2 Chemistry"
SS5+AS+EM  Semiconducting Surfaces
  • Stacey Bent, Stanford University, "Functionalizing Semiconductor Surfaces and Interfaces"
SS6+EM+NS  Defects in and Functionalization of 2D Materials
  • Thomas Michely, University of Cologne, "Holes, Pinning Sites and Metallic Wires in Monolayers of 2D Materials"
SS7+AS+HC  Role of Water/Solvent on Surface Structure - Catalysis and Electrocatalysis
  • Lars Grabow, University of Texas at Houston, "Using Water as a Co-catalyst in Heterogeneous Catalysis to Improve Activity and Selectivity"
SS8+EM+NS  Photon Driven Processes at Surfaces
  • Piotr Piotrowiak, Rutgers University
SS9+AS+BI+MI+NS  Organic/Inorganic Surfaces,  Interfaces and Nanostructures
  • Janice Reutt-Robey, University of Maryland, College Park, "Lithiation Dynamics at Nanobattery Interfaces"
SS10+HC+TF  Metal and Covalent Organic Frameworks (MOFs and COFs) on Surfaces
  • Christof Woll, Karlsruhe Institute of Technology, "Designer Solids via Multi-Heteroepitaxy : Layer-by-Layer Deposition of Molecular Frameworks"
SS11+HC  Near/Ambient Pressure and Bridging Gaps between Surface Science and Catalysis
  • John Hemminger, University of California Irvine, "Ambient Pressure Electron Spectroscopy (XPS, XAS) and Electron Microscopy Studies of the Structure and Chemistry of Nanostructured Model Catalysts"
SS12+EM+PS+TF  Deposition, Etching and Growth at Surfaces
  • Gionvanni Costantini, Warwick University, UK, "Controlled Deposition and High-Resolution Analysis of Functional Macromolecules in Ultrahigh Vacuum"
SS13+HC+NS+PS  Controlling Mechanisms of Surface Chemical Reactions
  • Angelos Michaelides, University College London, UK, "Bond Making and Bond Breaking at Wet and Dry Surfaces"
SS14 Surface Science Division Poster Session

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Thin Film (TF)

The Thin Film Division offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will touch on topics across the breadth of thin film science, technology and applications. There are several sessions dedicated to thin film deposition and processing, including energy conversion and storage, electronics, photovoltaics, 3D and extreme geometries,  precursors, surface reactions, memory, magnetics, organic-inorganic hybrid materials, manufacturing and up-scaling. These sessions highlight basic science and the pursuit of applications.  Furthermore, we offer sessions on in-situ diagnostics for CVD and ALD processes, organic-inorganic interface engineering and modeling of thin film processes. There will also be new sessions around emerging applications, including thin film flexible electronics, and integration of thin films and nanostructures for sensing and energy harvesting. We are also excited to announce, in collaboration with the Plasma Science & Technology Division, a new session track on Atomic Layer Processing (ALP), to highlight the synergy between ALD and ALE.  Abstracts are solicited on topics ranging from atomic layer etching (plasma or thermal), area selective deposition, chemistry and surface reactions for ALP and integration of ALD and ALE. Other relevant ALP topics also include area selective patterning, plasma-enhanced ALD, emerging applications, diagnostics and high volume manufacturing of ALP. Again this year, we will host a student-focused session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TEDTalk” type of forum.  Finally, we will host a special session in honor of Paul Holloway to celebrate his contributions to the AVS: Luminescent Materials Growth, Synthesis and Characterization

TF1 ALD for Energy Conversion, Storage and Electrochemical Processes
  • Brecht Put, IMEC & KU Leuven,  Belgium "Thin Films for Next Generation Batteries"
TF2+EL+EM+NS+SS  Integration of Thin Films and Nanostructures for Sensing and Energy Harvesting
  • Deji Akinwande, The University of Texas at Austin, "Applications of 2D flexible Nanoelectronics for Future Communications"
TF3+AS+EM+NS+PS+SS  Thin Film Flexible Electronics – Materials, Processes and Device Patterning
  • Tomoyuki Yokota, The University of Tokyo, Japan, "Ultraflexible Organic Electronics for Bio-medical Applications"
TF4+EM+MI  Thin Film Processes for Electronics
  • David Meyer, Naval Research Lab, “Crystalline Conductors: Transition Metal Nitride Materials and Device Applications"
TF5 ALD and CVD Precursors and Surface Reactions
  • Gregory Girolami, University of Illinois at Urbana-Champaign
TF6 ALD and CVD Manufacturing and Up-scaling
  • Arrelaine Dameron, Forge Nano, USA, "ALD for Batteries"
TF7 Emerging Applications for ALD
  • Junling Lu, University of Science and Technology of China, Hefei, China, "Applications of Atomic Layer Deposition on Catalysis"
TF8 Thin Films for Photovoltaics
  • Thomas Riedl, Bergische Universitaet Wuppertal, Germany, "Atomic Layer Deposition for Organic and Perovskite Solar Cells"
TF9+AS  Modeling of Thin Film Processes
  • Douglas Irving, North Carolina State University, “A First Principles Perspective of Defects in Thin Films”
  • Adri van Duin, Pennsylvania State University
TF10+SS  Organic/Inorganic Interface Engineering
  • Naoto Shirahata, National Institute for Materials Science, Tsukuba, Japan, “Controlled Structure of Silicon Nanocrystals: Multi-Color Emissions and their Applications”
TF11+PS  Deposition Processes for 3D and Extreme Geometries
  • Alex Martinson, Argonne National Laboratory, “ALD in Metal Organic Frameworks: Toward Single Site Synthesis and Sinter-Resistant Catalysts”
TF12  Thin Film Organic/Inorganic Hybrid Materials
  • AnnaMaria Coclite, Graz University of Technology, Austria, "CVD of Thin Polymer Films for Engineered Material Properties"
TF13+2D+NS+SS  Processing of Carbon-based Thin Films and Nanostructures
  • Robert Weatherup, University of Cambridge, Cambridge,  UK, "Direct Observation of the Mechanisms of Graphene Growth during Chemical Vapor Deposition: Routes to Controlling Layer Number and Domain Size"
TF14+EM+MI+PS  Thin Films for Advanced Memory Applications and Magnetics
  • Chris Palmstrøm, University of California at Santa Barbara
TF15+EL+PS  In-situ Diagnostics for CVD and ALD Processes
  • Alessandra Quadrelli, CNRS, Lyon, France, “2D TMD Monolayer of MOS2 BY ALD and Insight in the Mechanism by Surface Organmetallic Chemistry”
TF16+AS  Special Session in Honor of Paul Holloway: Luminescent Materials Growth, Synthesis and Characterization
  • Markku Leskela, University of Helsinki, Finland, “Atomic Layer Deposition of Optoelectronic Materials”
  • Philip Rack, University of Tennessee Knoxville, “Nanoscale Focused Electron Beam Stimulated Processing
  • Olga Shenderova, Adamas Nanotechnologies, Inc., “Fluorescent Diamond Particles and Their Application”
  • Hendrik Swart, University of the Free State, Republic of  South Africa, “Luminescent Materials for Solid State Lighting”
TF17+AM+EM+PS  Atomic Layer Processing: Area Selective Deposition
  • Annelies Delabie, IMEC & KU Leuven, Belgium, "ASD of Metals and Metal Oxides"
  • Adrie Mackus, Eindhoven University of Technology, The Netherlands, Netherlands
TF18+PS  Atomic Layer Processing: Chemistry & Surface Reactions for Atomic Layer Processing
  • Cathleen Crudden, Queen's University, Canada, "Self-assembled Monolayers (SAMs) on Gold (via N-heterocyclic Carbenes)"
  • Michael Morris, Trinity College Dublin, Ireland, "Area-selective Polymer Brush Deposition"
TF19  Thin Film Poster Session

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Vacuum Technology (VT)

The Vacuum Technology Division (VTD) provides a forum for research in achieving, maintaining, measuring, and analyzing vacuum across a wide range of pressures, gas compositions and applications.  The 2018 VT oral program topics include: (1)Vacuum Measurement- special emphasis on the development of quantum based primary standards for total and partial pressure measurement,(2)Vacuum Pumping-special emphasis on UHV and XHV pumping systems,(3) Wall-Vacuum interactions-special focus on outgassing from additive manufacturing processes and surface science in accelerators,(4) Large Vacuum Systems-special emphasis on Lyophilization chambers, (5) Vacuum System Automation and Control, (6) Partial Pressure analysis, (7)Sample transfer under vacuum conditions. The VT Poster session Tuesday evening features the VT Student Poster Competition, with a first place award of up to $500, where students of any discipline are invited to share their innovative solutions to vacuum equipment challenges. Student presenter awards will also be given for the best oral presentations.  To be eligible for a student prize, the presenter must be registered as a student and present the work in a VT poster or oral session.
VT1 Vacuum Measurement - Focus: Vacuum and Quantum SI

VT2 Pumping, UHV and XHV
  • Steve Greuel, Nor-Cal Products
  • Evan Salim, ColdQuanta, “Compact Ultra High Vacuum Systems for Applications of Cold Matter”
VT3 Outgassing: Focus: Additive Manufacturing
  • Matthew Hartings, American University
VT4 Large Vacuum Systems and Accelerators-Focus on Lyophilization
  • Shweta Saraf, SLAC, “Vacuum Controls Design for LCLS-II”
  • Evgenyi Shalaev, Allergan
VT5 Vacuum System Automation and Control
  • Andy Sibley, Tri Alpha Energy, Inc., “Structured Software Design and Integration of the C-2W Fusion Vacuum System”
VT6 Surface Science for Accelerators
  • Irit Ruach-Nir, AMAT- Applied Materials, Israel, “The Importance of Vacuum Cleanliness in Semiconductor Process Control SEM Tools”
VT7 Partial Pressure Analysis

VT8 Vacuum Transfer/Vacuum Suitcase/Load Lock
  • Bevan Court, Kurt J. Lesker
  • Ady Hershcovitch, Brookhaven National Lab, “Plasma Window as Vacuum Atmosphere Interface for Various Applications”
VT9 Vacuum for Semiconductor Manufacturing
  • Svetland Radovanov, Applied Materials, Inc., “Beamline Technology and Current Modeling Capabilities for Ion Implantation”
VT10   Vacuum Component Manufacturing
  • Duane Bingaman, Kurt J. Lesker
VT11   Vacuum Technology Division Poster Session

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