AVS 67 IS SCHEDULED TO TAKE PLACE, AS PLANNED, OCTOBER 25-30, 2020 IN DENVER, COLORADO

COVID-19 Update - We realize that the COVID-19 outbreak is impacting every one of us and we hope that you, your friends, and families are all safe. The health and safety of our attendees, vendors, volunteers, and staff is our top priority and we are continuing to monitor developments related to the COVID-19 outbreak and its impact on global travel.
 
At this time, we are moving forward with planning for AVS 67 at the end of October anticipating that this pandemic will be under control by then. If we are still dealing with severe travel restrictions by the end of the summer, we will evaluate options and advise of any changes or cancellation. All updates will be communicated immediately to all registered meeting attendees and posted on the meeting website.
 
We understand that the evolving situation may affect your plans to submit an abstract by the extended June 1st deadline. Please know that AVS will be offering opportunities to submit an abstract over summer. If you have any questions, please contact della@avs.org
 

For the most up-to-date information regarding the virus, please refer to the World Health Organization and  U.S. Center for Disease Control and Prevention (CDC) web pages.
 

AVS 67 will:

  • Follow recommendations from the World Health Organization (WHO), the U.S. Center for Disease Control and Prevention (CDC), and the policies of the local government and city officials;
  • Identify local emergency care facilities that will be able to promptly care for attendees that may require treatment;
  • Work with local officials to establish procedures to handle any COVID-19 related incidents that occur at the meeting; and
  • Develop a mechanism and protocol to alert AVS 67 onsite staff and meeting attendees in case of an incident.

 

 

Call for Abstracts - Divisions & Groups

 



Advanced Surface Engineering (SE)

The program of Advanced Surface Engineering Division (SE) will cover a wide range of topics in surface engineering focusing on plasma-assisted vapor deposition, coating characterization, and utilizing surface engineering for industrial applications. The program includes four oral sessions and a poster session. The four technical sessions will be led by high profile invited speakers who will highlight recent advances in fundamental and cutting-edge research in surface engineering. The session “Vapor Depositions and HiPIMS in Surface Engineering” will emphasize the latest progress in surface modification and synthesizing thin films and coatings on all kinds of materials via vapor depositions, especially, advances in high density plasma-assisted deposition technologies, HiPIMS. The session “Nanostructured and Multifunctional Thin Films and Coatings” will feature presentations on the design and development of advanced nanostructured coatings for achieving multifunctionality to be used in various environments, e.g. wear, erosion, corrosion, high temperature, etc. Studies focusing on the deep understanding of the relationship between process, structure, and properties of advanced coatings and modified surfaces are appreciated. The session “Mechanical and Tribological Properties/Characterization of Thin Films and Coatings” will highlight contributions on fundamental understanding and applied research aspects for thin film and coating mechanical and tribological properties. The contribution includes new and advanced surface characterization techniques, analysis and characterization of modified surfaces, and the interaction of the surface with environment. The last session “New Trends and Industrial Application in Surface Engineering” invites contributors from academia and industry that focus on revealing future trends in surface engineering, e.g., new metallic glass coatings, high-entropy alloy (HEA) coatings, super hydrophobic surface, etc.  In addition, contributions that show how surface engineering can assist to solve real world problems in the industry will be included. SE will establish for the first time an award to recognize young investigators for their outstanding participation and research based on presentations in SE program sessions. Up to three finalists and one first prize winner will be selected and announced towards the end of the SE program.

SE1: Vapor Deposition and HiPIMS in Surface Engineering
  • Wan-Yu Wu, Da-Yeh University, Taiwan, Republic of China, "Low Temperature Thin Film Deposition on Flexible Substrate Using HiPIMS Technique"
SE2: Nanostructured and Multifunctional Thin Films and Coatings
  • Paul Mayrhofer, Technische Universitaet Wien, TU Wien, Austria, "High-Entropy Ceramic Thin Films; A Case Study of Nitrides, Oxides and Diborides"
SE3: Mechanical and Tribological properties/Characterization of Thin Films and Coatings
  • Giovanni Ramirez, Bruker Nano Surfaces, "Catalytically Active Nanocomposite Coatings for Tribological Applications"
SE4: New Trends and Industrial Applications in Surface Engineering
  • Jinn P. Chu, National Taiwan University of Science and Technology, Taiwan, Republic of China, "Metallic Glass: A Novel and Emerging Coating For Various Industrial Applications"
SE5: Advanced Surface Engineering Poster Session
 

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Applied Surface Science (AS)

The Applied Surface Science Division provides a forum for research in surface preparation, modification, and utilization for practical applications with a focus on Characterization of Surfaces, Interfaces, and Nanomaterials. The Division has long been the premier gathering place for the global community of surface analysts with historic emphasis on techniques such as SIMS, XPS, and Auger spectroscopies. We have long-standing analytical interests with traditional sessions such as quantitative surface analysis, industrial problem solving and advances in technique development. Our contributors present a blend of fundamental research in measurement science along with cutting-edge applied studies in nanoscience, materials for energy conversion, semiconductor processing, polymers, biotechnology and more. We strive to grow in new areas for future development in applied surface analysis and analytical data processing. For AVS 67 we are also encouraging contributions focusing on the roles of surfaces and interfaces in materials, technologies, and processes relating to energy and the environment. Novel surface analytical methods for providing insight into surfaces, such as Atom Probe, Hard x-rays, Ellipsometry and in operando techniques are welcome. We also welcome and encourage contributions concerning reproducibility issues.
 
AS1+BI+CA+LS: Quantitative Surface Analysis
  • David Cant, NPL, UK “Hard Targets: Developing tools for quantitative HAXPES”
  • Peter License, The University of Nottingham, UK, "Ionic Liquids in Vacuo: Suck-it and See!“
AS2+BI+CA+LS+NS+SE+SS: Analysis of Surfaces and Interfaces Related to Energy and the Environment
  • Julia Maibach, Karlsruhe Institut for Technology (KIT), Germany, "Batteries at Work: Ambient Pressure Photoelectron Spectroscopy for Lithium ion batteries”
AS3+AC+BI+CA: Getting the Most out of your Analysis using Complimentary Techniques
  • Alexander Gray, Temple University,  "Combining multiple x-ray spectroscopic and scattering techniques to probe emergent electronic phenomena at oxide interfaces"
AS4+HC+PS+SE+SM: Modification of Surfaces and Interfaces for Practical Applications
  • Robyn E. Goacher, Niagara University, "Going Beyond Superficial Surface Analysis for Transforming Plants into Value-added Products“
AS5+AC+BI+SS: Applied Surface Science and Data Processing
  • Brian Gorman, Colorado School of Mines, “Combining APT and TEM into a Single 3-D Atomic Scale Technique”
AS6+BI: Combining Depth Profiling with Surface Analysis
  • Birgit Hagenhoff, Tascon, Germany, “Towards Organic 3D Characterization: SIMS Analysis Using Ar Cluster Ions”
AS7: Applied Surface Science Division Poster Session

 
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Biomaterial Interfaces (BI)

The 2020 AVS program from the Biomaterial Interfaces Division presents an interdisciplinary forum for the  discussion of fundamental aspects of bio-interface science and engineering. The BI program brings together recent advances made in materials science and molecular biology with sophisticated surface and interface analysis methods along with theoretical and modeling approaches for biological systems and biomaterials. Focus areas for this year include: Biofabrication; Bioanalytics; Bioelectronics and Biosensing; Diagnostics; Cutting edge Bio: Bio-Nano, Bioenergy and Biomass Conversion; 3D Bio; High-Resolution Microscopy; both in- and ex-situ Characterization of Biological and Biomaterial Surfaces;  Biomolecules and Biophysics and Interfaces; Microbes and Fouling at Surfaces. In addition we will be hosting sessions in the topic area of Matter-to-Life, including Synthetic and Programmable Cells, Synthetic Life at the Nanoscale, and the Route to Replication. Our program will also feature our highly interactive BID Poster session, including a Flash Poster session Tuesday afternoon before the main poster session. We therefore invite submissions of Flash/Poster Presentations. Student entrants will be considered for awards for the best Flash/Poster contributions.
 

BI: Materials and Biology for the Future of Energy and the Environment
  • Steven Benner, Foundation for Applied Molecular Evolution and Firebird Biomolecular Sciences LLC
  •    Pamela Silver, Harvard University, “Designing Biology for Health and Sustainability”
BI1: Microbes and Fouling at Surfaces
  • Ana Flores Mireles, University of Notre Dame, "Understanding the Role of Catheter-Associated Protein Deposition in the Development of CAUTI"
BI2: Biomolecules and Biophysics at Interfaces
  • Yuhang Hu, Georgia Tech, "Using Indentation to Characterize the Poroelastic and Adhesion Properties of Soft and Wet Materials"
BI3: Characterization of Biological and Biomaterials Surfaces

BI4: Bioanalytics and Diagnostics
  • John X. J. Zhang, Dartmouth, "Liquid Biopsy on Microchips"
BI5: Biomaterials and Nanomaterials Fabrication
  • Benham Akhavan, University of Sydney, Australia, "Plasma Surface Engineering of Bone Implantable Materials"
BI6: 3D Structures and 3D Analysis of Biomaterials
  • Laura Arriaga, Autonomous University of Madrid, Spain, "Emulsion-Templated Vesicles in Motion"
BI7: Simulation and Modeling of Biomaterials and Biosystems
  • Sinan Keten, Northwestern University, "Bioinspired and Biological Adhesion at Interfaces"
BI8: High-Resolution Microscopy of Biosystems and Biomaterials
  • Mary Kraft, University of Illinois, "NanoSIMS Imaging of Cholesterol and Sphingolipids in Cell Membranes"
BI9: In situ Characterization of Biomaterials
  • Karissa Tilbury, University of Maine, "Microscopy Applications in Characterization of Cellulose Nanofiber as a Biomaterial"
BI10: Bioelectronics and Biosensing

BI11: Bioenergy and Biomass Conversion
  • Thomas Schwartz, University of Maine, "A Platform Chemical Approach for the Production of Biobased Chemicals"
BI12: Matter-to-Life I Synthetic and Programmable Cells
  • Joachim Spatz, University of Heidelberg, Germany, "Bottom-Up Assembly of Synthetic Cells"
BI13: Matter-to-Life II Synthetic Life at the Nanoscale
  • Eberhard Bodenschatz, Max Planck Institute, Germany, "Stimuli-Responsive Core-Gap-Shell Microcapsules for Matter to Life"
BI14: Matter-to-Life III the Route to Replication
  • Hendrik Dietz, TU Munich, Germany
BI15: Biomaterial Interfaces Poster & Flash Session
 

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Electronic Materials & Photonics (EM)

The Electronic Materials and Photonics Division welcomes abstract submissions in any aspect of the science and engineering of materials, interfaces, and processing that advance the production and/or fundamental understanding of electronic, photonic, and optoelectronic technologies.  Topics planned for AVS 67 include materials, processes, and devices for advanced logic, memory, and interconnect applications, as well as a session for computational methods to discover new materials and devices. Consistent with the theme of AVS 67, we are devoting sessions to the advances in interfacial science necessary for electronic and photonic devices for energy and the environment.  Topics include, but are not limited to, computational modeling, 2.5D and 3D heterogeneous integration, low-power electronics, power electronics, photovoltaics, and thermoelectrics.  We will also hold a session covering the latest advances in electronic and photonic nanostructure synthesis, assembly, and properties, as well as the techniques required for their characterization on the nanoscale.  As in past years, we will offer graduate student poster awards as well as post-doc travel awards to help create a forum in which younger scientists can present their work and develop relationships for the future.
 

EM1+BI+NS+PS+TF: Electronic and Photonic Materials and Devices
  • Paul Lane, National Science Foundation, “Advances and Opportunities in Electronic, Photonic and Magnetic Devices”
EM2+PS+TF: New Devices and Materials for Logic, Memory, and Interconnects
  • Zhiguo Qian, Intel Corporation, "Advanced Packaging Interconnects"
  • Bhadri Varadarajan, Lam Research Corporation, "New Materials Development to Meet Future Integration Needs"
EM3+TF: Wide and Ultra-wide bandgap materials and devices
  • Brianna Klein, Sandia National Laboratories
EM4+BI+MI+MN+NS: Bottom-up Nanostructures
  • Samuel G. Carter, U.S. Naval Research Laboratory, “Epitaxial Quantum Dots for Quantum Science and Technology”
  • Julia Greer, CalTech
EM5+MI: Electronic and Photonic Devices for Energy Conversion and Storage
  • Kristopher O. Davis,  University of Central Florida, “Photon Management, Surface Passivation, Carrier Selectivity, and Carrier Transport”
  • Vivian Ferry, University of Minnesota, "Light Management Strategies for Photovoltaic Modules and Luminescent Solar Concentrators"
EM6+MN: 2.5 and 3D Heterogeneous Integration
  • Ravi Mahajan, Intel
  • Jian Shi, Rensselaer Polytechnic Institute, "Remote Epitaxy of Complex Materials"
EM7+PS+TF: Atomic Scale Processing for Devices
  • Ola Nilsen, University of Oslo, Norway, “Building MOFs from the Gas Phase at the Molecular Level - Active Surfaces by Combining Organics with Inorganics”
  • Jin-Seong Park, Hanyang University, South Korea
EM8+TF: Accelerated Materials and Device Discovery: Simulation and Modeling
  • Elif Ertekin, University of Illinois, "Accelerated Discovery of New Thermoelectrics: High-throughput Approach to Dopability Predictions in Diamond like Semiconductors"
EM9: Electronic Materials and Photonics Poster Session
 

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Magnetic Interfaces & Nanostructures (MI)

This year’s Magnetic Interfaces and Nanostructures Division program features pioneering, provocative, introductory, and emerging results in topical areas related to magnetic interfaces and nanostructures. Particular attention will be given to research areas in magnetism that are of strong interest to the AVS community so that maximum overlap with other divisions and focus topics can be achieved. The program will cover a wide area of topics ranging from chiral magnetism and spin orbit effects at interfaces to magnetism in magnetocaloric materials. The focus of the program is to cover areas of magnetism that are fascinating from a fundamental point of view but which carry significance for future applications. In addition, we would like to especially focus on the synergy between the research areas covered by MI and their role for the development of new materials and devices for the information society. For this reason the program will feature a special mini-symposium “Highlighting Women Researching Magnetism.”  The Magnetic Interfaces and Nanostructures Division will be selecting the best graduate student presentation from finalists for the Leo Falicov Award. MI will also offer an award for postdoctoral fellows who will be presenting papers at this International Symposium. The winners of both awards will be announced towards the end of the meeting.
 
MI1: Topological Insulator Heterostructures
  • Badih Assaf, University of Notre Dame, "Magnetism in Topological Crystalline Insulator Heterostructures"
  • Leonid Rokhinson, Purdue University, "Building New Platforms to Form Non-Abelian Excitations"
MI2: Spin Landscape I: Magnetic Structures in Real and Momentum Space
  • Sinead Griffin, Lawrence Berkeley National Laboratory
  • Art Smith, Ohio University, "Surface Magnetic Properties of Spintronic Nitride Materials Studied using Spin-polarized Scanning Tunneling Microscopy & Spectroscopy"
MI3: Spin Landscape II: Magnetic Structures for Energy-Efficient Computing/Devices
  • Daniel Wegner, Radboud University, The Netherlands, "From Spin Spirals to Spin Glasses - Imaging Complex Magnetism on the Atomic Scale"
MI4: Mini Symposium: Highlighting Women Researching Magnetism
  • Jamileh Beik Mohammadi, Loyola University New Orleans
  • Michelle Jamer, United States Naval Acadamy, “Moving Toward Antiferromagnetic Straintronics”
  • Claudia Meves, University of Alabama, "Computational Frontier of Spintronic Materials"
  • Annika Schlenhoff, University of Hamburg, Germany, "Vacuum Resonance States as Atomic-Scale Probes of Noncollinear Surface Magnetism"
MI5: Magnetic Interfaces and Nanostructures Poster Session
 


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MEMS & NEMS (MN)

The MEMS and NEMS Technology Group program will highlight recent advances in broad areas of micro/nanoelectromechanical systems (MEMS/NEMS), especially latest fundamental studies of novel materials, processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas. The AVS 67 MN program will include a focus on integration and interface. Specific highlights for AVS 67 will be nanotribology and nanomechanics at the interface and MEMS technology for energy and environment. Our program will also include MEMS/NEMS heterogeneous integration, and nanomechanics and optomechanics for quantum computing and sensing. The program continues to embrace latest progress in optical MEMS/ NEMS, micro/nanophotonics, optomechanics, quantum MEMS/ NEMS, resonant systems, CMOS-MEMS, mesoscopic dynamics and dissipation processes, environmental sensors, harsh-environment transducers, and MEMS/NEMS-enabled energy and sensing/imaging technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS for biosensing, bio-inspired microsystems, wearable and wireless healthcare.

MN1+BI+EM: MEMS Technology for Energy and Environment
  • Gregory Whiting, University of Colorado Boulder, "Printed Biodegradable Sensors for in-situ Monitoring of Nitrate and Moisture in Soil"
MN2+2D+SE+SS: Nanotribology and Nanomechanics at the Interface
  • Anirudha Sumant, Argonne National Laboratory, "Superlubricity: Eliminating Friction and Wear in Microscale Machines to Macroscale Mechanical Systems"
  • Juan Xia, University of Electronic Science, China, "Interlayer Vibration Mechanics in 2D TMDC Revealed by Ultra-low-frequency Raman Spectroscopy"
MN3+2D+NS+QS: MEMS & NEMS Enabled Sensing & Imaging
  • Robert W. Carpick, University of Pennsylvania, "Nanoscale Contact, Adhesion, Friction, and Wear of 2D Materials Studied by a Novel In-situ TEM-based AFM Method"
  • John Marohn, Cornell University, "Electric Force Microscopy: Achieving Nanosecond Time Resolution using Phase Kicks and Getting the Tip-Sample Interaction Right using Lagrangian Mechanics"
MN4+2D+NS+QS: Nanomechanics and Optomechanics for Quantum Computing and Sensing
  • Cindy Regal, University of Colorado, Boulder, "Mechanical Sensing and Quantum Limits"
MN5+AP+BI+EM+PS+SE+TF: MEMS and BioMEMS Processes, Materials, and Devices
  • Victor Bright, University of Colorado Boulder, "Engineering Microdevices Using Atomic Layer Deposition and Etching"
MN6: MEMS and NEMS Heterogeneous Integration
  • Alejandro Griñe, Sandia National Laboratories, "Chip-Scale, Minimally Supported Optomechanical Devices with High Finesse for Sensing"
  • John Kitching, NIST, "Chip-scale Atomic Devices with Integrated Photonics"
MN7: MEMS and NEMS Poster Session
 


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Manufacturing Science & Technology (MS)

The Manufacturing Science and Technology sessions bring together invited speakers to highlight the challenges needing to be addressed for successful manufacturing of next generation devices and technologies.  Our sessions are meant to generate synergy among scientists and engineers working across the spectrum of these technologies, including basic science research, metrology, processing, and development, to encourage everyone to keep these manufacturing challenges in mind as they move the technologies forward.  This year we are highlighting the areas of Atomically Precise Manufacturing, Manufacturing for Quantum Computing, and Manufacturing of AI Hardware.

MS1+AP+NS+TF: Science and Technology for Atomically Precise Manufacturing
  • Linda Horton, Department of Energy, “Basic Research Challenges and Opportunities for Next Generation Manufacturing”
  • Michael Koltonski, Micron Technology
  • Van Le, Intel
  • Shashank Misra, Sandia National Laboratories, "Digital Electronics at the Atomic Scale"
  • Tetsuya Tatsumi, Sony Semiconductor Solutions Corporation, Japan, "Control of Plasma and Surface Reactions for Atomically Precise Device Fabrication"
MS2+AP+EM+QS+TF: Science and Technology of Manufacturing for Quantum Computing
  • Jerry Chow, IBM Research Division, T.J. Watson Research Center
  • Philip Hemmer, Texas A&M University, "Qbit Manufacturing"
  • Quanxi Jia, University of Buffalo, SUNY, "Superconducting Materials for Quantum Computing: Approaches, Challenges, and Opportunities"
  • Jason Orcutt, IBM, “Reproducible Superconducting Circuits for Quantum Information Processors”
  • Mohammad Soltani, Raytheon, "Photonic Platforms"
MS3+AP: Science and Technology of manufacturing AI Hardware
  • Nicholas Breil, Applied Materials Inc., “Memory Materials, Integration and Design for Analog Compute Applications”
  • Michael Lercel, ASML, "EUV Lithography"
  • Alec Talin, Sandia National Laboratories, “Low Power Computing with Ion Tunable Electronic Materials”
  • Brian Valentine, Department of Energy, “Manufacturing R&D for Artificial Intelligence Hardware”
  • J. Joshua Yang, University of Massachusetts Amherst, “Memristive Devices for AI Applications”
MS4: Manufacturing Science and Technology Poster Session
 

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Nanoscale Science & Technology (NS)

Sessions in the Nanoscale Science and Technology Division cover the science and technology of the creation, characterization, and function  of nano-scale assemblies and structures, exploiting the unique properties associated with low dimension and size.  Our program provides a rich forum for exploring a wide range of phenomena which can be induced, measured, and exploited at the nanoscale. The sessions strongly emphasize new and exciting technologies and instrumentation, with scanning probe and near-field  microscopies being particularly highlighted. Nonetheless,  cutting-edge and fundamental science is central to the divisional themes: Specifically, topics  discussed include mechanical and electrical phenomena at the nano-scale, sensors and sensing, quantum phenomena, nanophotonics, nanofabrication and spectroscopy. The relevance of these topics to society in general, such as their role in environmental and energy-related problems is particularly emphasized in the AVS 67 program. In parallel, the influence of nanoscale structure on properties of materials and  constructs at larger dimensions will be discussed. This year, in addition to the scientific sessions, NSTD is organizing a workshop on undergraduate education in nanoscale science and technology. We hope this will be of general interest and bring a useful forum for the educators amongst our attendees.

NS1+AS+BI+EM+LD+SS: Scanning Probe Microscopy and Spectroscopy for Energy and Environment
  • David Ginger, University of Washington, Seattle, "Interfaces in Halide Perovskite Solar Cells"
  • Yabing Qi, Okinawa Institute of Science and Technology Graduate University,  Japan, Japan, "Perovskite Material and Solar Cell Research by Surface Science and Advanced Characterization"
NS2+MI+QS+SS: Quantum States at Surfaces
  • Shahal Ilani, Weizmann Institute of Science, Israel, "Visualizing Strongly Interacting Quantum Matter"
  • Ilija Zeljkovic, Boston College, "Spin-Polarized Scanning Tunneling Microscopy Imaging of Quantum Materials"
NS3+MN+QS+SM+SS: Nanomechanics – Including Nanoscale-Dependent Materials' Properties and Quantum Effects
  • Sonia Antoranz Contera, Oxford, UK, "Mapping Nanoscale Viscoelasticity and Relaxation Times Underlying Growth and Shape of Multicellular Organisms using Multifrequency AFM"
  • Konrad Lehnert, JILA, "Quantum Phononics"
  • Jeremy Munday, University of California at Davis, "Engineering Quantum Forces and Torques"
NS4+AP+BI+SS: Advances in Scanning Probe Technologies
  • Takeshi Fukuma, Kanazawa University, Japan, "Visualizing 3D Self-Organizing Systems by In-liquid AFM"
  • Markus Raschke, University of Colorado Boulder, "Advances in Optical Nano-Probe Imaging: Probing Structure, Coupling, and Dynamics on the Molecular Scale"
NS5+BI+SS+TF: Emergent Properties of Nanostructured Surfaces: from Metasurfaces to Superhydrophobic
  • Alexandra Boltasseva, Purdue University, "Deep Machine Learning Assisted Photonics"
  • Teri Odom, Northwestern University, "Nanoscale Optics in Flatland"
NS6+MI: Energy Efficient Nanoelectronics
  • An Chen, IBM Almaden Research Center, "Nanoelectronic Devices and Architectures for Energy-Efficient Computing"
  • Robert Wolkow, University of Alberta, Canada / Quantum Silicon Inc., Canada, "Atom Defined Silicon Circuit Elements Enable Very Low Power and Fast Computing"
NS7+AP+BI+SM: Nanofabrication
  • Chuck Black, Brookhaven National Lab, “Self-assembly Based Nanofabrication using Block Copolymers”
  • Oleg Gang, Brookhaven National Laboratory, "Programming Assembly of 3D Nanoscale Systems"
  • John Randall, Zyvex Labs, "Digital Atomic Scale Fabrication Applied to Integrated Solid State Quantum Devices"
NS8+SS: Spectroscopic Atomic Force Microscopies for Nanophotonics and Sensing
  • Andrea Alu, CUNY, "Metamaterials and Polaritons for Imaging and Sensing"
  • Rainer Hillenbrand, CIC nanoGUNE, Spain, "Advances in IR and THz Nanoimaging and Nanospectroscopy"
NS9: Nanoscale Science and Technology Poster Session
 

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Plasma Science & Technology (PS)

The 2020 Plasma Science & Technology Division program highlights state-of-the-art advances in plasma science, ranging from fundamental studies of plasma physics and chemistry, plasma-matter interactions to new applications for plasma processing. Our diverse international community includes researchers from academia, national laboratories, and industry covering topics extending from the latest advancements in plasma research for established fields such as semiconductor fabrication to newer areas of study such as energy research, novel materials synthesis, catalysis, and biomedical applications, where plasma is either the focus or the enabling tool. Abstracts describing novel research are solicited in areas concerning: Advanced BEOL: Interconnect Materials and Etching; Advanced FEOL: plasma processing for logic devices; EUV and Multipatterning: Advanced Packaging, Thermal Management, and Heterogeneous Integration; Plasma Processing for Advanced and Emerging Memory Technologies; Plasma-assisted Atomic Layer Etching; Plasma Surface Interactions; Plasma Deposition and  ALD processes for coatings and thin films; Plasma Diagnostics, Sensors and Control; Plasma Sources; Modelling of plasmas, Plasma-Driven Processes, and Machine Learning; Atmospheric Pressure Plasmas and their applications; Plasma Chemistry and Catalysis; Plasmas  for the environment (e.g. water, air, soil treatment); Plasma-engineered materials and interfaces for the environment; Plasma and plasma-engineered materials for energy savings; Plasma for medicine and biointerfaces. We invite abstracts for both oral sessions and poster sessions, the latter of which provide an excellent opportunity for one-on-one discussions of new results with colleagues. Special consideration will be given to papers that highlight cross-disciplinary issues of the research. The authors are also encouraged to submit their original results to the accompanying AVS journals.

PS1+EM: Advanced BEOL: Interconnect Materials and Etching
  • Suketu Parikh, AMAT- Applied Materials, “Industry Trends in Interconnect Technology”
  • Kensuke Taniguchi, TEL Miyagi Limited, Japan, "BEOL Next Generation Etching Challenges"
PS2+EM: Advanced FEOL: Plasma Processing for Logic Devices
  • John Sporre, IBM Research Division, Albany, NY, “Etch Processes for Enabling Next Generation Devices”
PS3+AP+EM+TF: EUV and Multipatterning: Advanced Packaging, Thermal Management, and Heterogeneous Integration
  • Sophie Thibaut, TEL, "Multipatterning of Immersion and EUV Lithography"
  • Rich Wise, Lam Research
PS4+SE: Atmospheric Pressure Plasmas and their Applications
  • Ana Sobota, TU Eindhoven, Netherlands, “The Influence of the Target on the Plasma in Atmospheric Pressure Non-Thermal Plasma Jets”
PS5+AP+EM+TF: Plasma Assisted Atomic Layer Etching
  • Takayoshi Tsutsumi, Nagoya University, Japan, "Surface Reaction Analysis during Atomic Layer Etching Processes for Si-compound"
PS6: Modelling of Plasmas, Plasma-Driven Processes, and Machine Learning
  • Anne Bourdon, Ecole Polytechnique, France, “Current Modeling and Simulation Challenges of Low-Temperature Plasmas”
PS7+AP+TF: Plasma Deposition and  ALD Processes for Coatings and Thin Films
  • Silvia Armini, IMEC, Belgium
PS8: Plasma Diagnostics, Sensors and Control
  • Jean-Paul Booth, CNRS, Ecole Polytechnique, France, "Plasma Prize Invited Talk: What We Still Don't Know About Plasmas in Simple Diatomic Gases- or How a DC Plasma in Pure O2 Can Be an Ideal Test-Bed for Experimental Validation of Simulations"
PS9+SE: Plasma Sources
  • John Chambers, AGC North America, "Linear Hollow-cathode PECVD for High Deposition Rate Coatings and Varied Properties of Deposited Materials"
  • Christine Charles, ANU, Australia, “Laboratory and Space Applications of Expanding Plasmas”
PS10+AS+BI+EM+SS: Plasma-Surface Interactions
  • John Daugherty, Lam Research, "Plasma-wall Interactions: Implications for Advanced Chamber Material Requirements"
PS11+AS: Plasma Chemistry and Catalysis
  • David B. Go, University of Notre Dame, “Understanding and Designing Plasma-Catalysis Systems using Experiments and Simulations”
  • Michail Tsampas, Dutch Institute for Fundamental Energy, The Netherlands, “Plasma Activated Electrolyser for Nitrogen Fixation by Water”
PS12: Plasmas  for Environment: Water, Air, Soil Treatment
  • Selma Mededovic, Clarkson University, “Plasma-Induced Formation of Reactive Chlorine Species and Their Effect on Interfacial Kinetics”
PS13+TF: Plasma-engineered Materials and Interfaces for the Environment
  • Ellen Fisher, Colorado State University, “Optimizing Plasma Processes to Lower Environmental Impact through Understanding Fundamental Plasma Kinetics and Energetics”
PS14+TF: Plasma and Plasma-engineered Materials for Energy Savings
  • Xungang Diao, Beihang University, China, "All Solid State Thin Film Electrochromic Devices: Fabrication, Performance and Applications"
PS15+EM: Plasma Processing for Advanced and Emerging Memory Technologies
  • Nicole Saulnier, IBM, “Plasma Process Requirements for Emerging Memories”
PS16+BI+SM: Plasma for Medicine and Biointerfaces
  • Marcela Bilek, The University of Sydney, Australia, "Recent Advances in Plasma Processing for the Creation of Tunable Biofunctional Surfaces and Interfaces"
PS17: Plasma Science and Technology Poster Session
 


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Surface Science (SS)

The Surface Science Division provides a forum for cutting-edge research that involves solid surfaces and interfaces. Phenomena that take place at the gas-solid and liquid-solid interfaces are prominent within the Division programs. Technical sessions address atomistic, structural, electronic and chemical phenomena at surfaces and interfaces, their impact on materials properties, and their implication for technology and environmental processes. Surface Chemistry is an important divisional theme, encompassing the kinetics and dynamics of surface chemical events from adsorption and reaction to catalysis. Film and nanostructure growth is another key theme, explored from a fundamental perspective, through the development of new growth and processing methods for materials preparation. Surface chemical modification and photon-driven chemistry at surfaces are important concentrations. Lively sessions are devoted to the surface science of metallic, semiconductor, oxide and organic surfaces that support unique chemical activity and electronic properties. Surface science applications in high-impact areas - particularly energy science, microelectronics, nanotechnology, and environmental science - are highlighted in the program. This Division's overarching goal is to provide the atomistic insights on solid surfaces and interfaces needed to advance our understanding of materials systems and benefit society.
 
SS1+CA+TF: Dynamics and Mechanisms at Surfaces and Interfaces
  • Maite Alducin, Materials Physics Center, San Sebastián, Spain, "Laser-induced Dynamics and Reactions of Adsorbates on Metals: Hot Electrons or Hot Phonons?"
  • Theofanis Kitsopoulos, Max Planck Institute for Biophysical Chemistry and Institute of Physical Chemistry, University of Göttingen, Germany, "Probing the Kinetics and Dynamics on Metal Surfaces using Ion Imaging Methods"
SS2+AS+QS: Artificial Intelligence, Machine Learning, and Quantum Chemistry
  • John Kitchin, Carnegie Mellon University, "Light-driven Hydrogen Evolution Catalysts using High Throughput Simulation, Experiments and Machine Learning"
SS3+AS+BI+CA+HC+LD+PS: Environmental and Atmospheric Interfaces
  • Markus Ammann, Paul Scherrer Institut (PSI), Switzerland, "Chemistry and Hydrogen Bonding Environment at the Surface of Minerals, Aqueous Solutions and Ice as Seen by X-ray Photoelectron and Electron Yield NEXAFS Spectroscopies"
SS4+CA+HC+NS: Photochemistry at Surfaces for Energy Applications
  • Prashant Kamat, University of Notre Dame, "Halide Ion Mobility in Metal Halide Perovskites and its Impact on Photovoltaic Performance"
SS5+2D+NS+SM+TF: Nanostructured and Hierarchical Surfaces
  • Yu Huang, University of California at Los Angeles, "Surface Engineered High Performance Catalysts"
SS6+2D+AP+PS+TF: Surface Chemistry of Film Growth and Etching
  • Stacey Bent, Stanford University, "Mechanisms of Film Growth by Atomic Layer Deposition"
SS7+AP+AS+HC+LD+SE+TF: Oxides and Semiconductor Surfaces and Interfaces
  • Ye Xu, Lousiana State University, "Interaction of Small Heteroatomic Organic Compounds with Ceria"
SS8+2D+AP+BI+NS+TF: Molecular Organization at Surfaces
  • Meike Stohr, University of Groningen, The Netherlands, Netherlands, "Molecular Nanostructures on Metals vs. Graphene"
SS9+SE: Astrochemistry and Surfaces for Space and Extreme Environments
  • John Hennessy, Jet Propulsion Laboratory, California Institute of Technology, "Atomic Layer Processing for Space-based Optical Coatings"
  • Ewine van Dischoeck, Leiden University, The Netherlands, Netherlands, "Molecular Processes in Ultrahigh Vacuum Between the Stars"
SS10: Surface Science Division Poster Session
 


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Thin Film (TF)

The Thin Film Division offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will cover the breadth of thin film science, thin film interfaces, technology, and applications. We have several  sessions dedicated to ALD and CVD, encompassing from surface reactions and growth mechanisms to novel processes, precursors, scale up, and emerging applications, and sessions dedicated to novel materials by a wide range of deposition processes, including epitaxial films and interfaces, solution based methods, and the application of simulation and machine learning to thin film growth. Additionally, the division has a strong focus on the application of thin films, including  microelectronics and advanced memory applications, interfaces and contacts, flexible electronics, plasmonic, photonic, and metamaterials, energy, and catalysis. It has also a session dedicated to advances in deposition methods of wide bandgap and ultrawide bandgap materials. This year, the division is also introducing two new sessions on thin films for quantum computing and it also features a session on interfacial phenomena in thin film growth. Finally, the division continues its focus on organic and hybrid materials, including the modification of polymers using vapor infiltration methods and the vapor deposition of functional polymer films. As in past years, we will host a student-focused session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TEDTalk” type of forum.
 

TF1+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD
  • Wei-Min Li, Leadmicro
TF2+2D+AP+SS: ALD and CVD: Surface Reactions, Mechanisms, and Kinetics
  • Rong Chen, Huazhong University of Science and Technology, China, "Inherent Selective Atomic Layer Deposition Strategies and Applications"
TF3+AP+MN+SS: Novel ALD Processes
  • Shi-Jin Ding, Fudan University, China, “Atomic-Layer-Deposited Metal Oxide Semiconductor Films for Electronic Devices”
TF4+PS+SE: HiPIMS for Emerging and Advanced Materials
  • Brian Jurczyk, Starfire Industries LLC
TF5+AP: ALD/CVD Precursors
  • Won-Jun Lee, Sejong University, Republic of Korea, “Heteroleptic Titanium Precursors for ALD of TiO2
TF6+SS: Simulations and Machine Learning Applied to Thin Film Phenomena

TF7+AP+SS: Nucleation and Interface Phenomena in Thin Film Deposition and ASD
  • Mariona Coll, ICMAB - CSIC, Spain, "Novel Metalorganic Precursors for ALD Functional complex Oxide Thin Films"
  • Vincent Vandalon, Eindhoven University of Technology, The Netherlands, "Mechanistic Insight into Atomic Layer Deposition during Initial Growth by In-situ Diagnostics"
TF8+SS: Epitaxial Thin Films and Interfaces
  • Jason Kawasaki, University of Wisconsin - Madison, "Heusler Interfaces: Opportunities Beyond Spintronics"
TF9+BI: Solution-based Thin Film Deposition
  • Aram Amassian, North Carolina State University, "Solution-based Coating of Next Generation Polycrystalline and Monocrystalline Semiconductors"
TF10+HC+SS: Thin Films for Energy and Catalysis

TF11+AP+EM+MI: ALD/CVD Thin Films for Integrated Solutions in Advanced Memory Applications

TF12+EM: Thin Films for Microelectronic Applications
  • Baratunde Cola, Georgia Institute of Technology, "Progress in Practical Carbon Nanotube Optical Rectenna Development"
TF13+EM+MI: Thin Films in Plasmonic, Metamaterials and Photonic Applications
  • Joshua Caldwell, Vanderbilt University, “Refractive Index Control of IR Light in Highly Anisotropic Media”
TF14+EM: Electronic Interfaces and Contacts
  • Prineha Narang, Harvard University, “Ab Initio Predictions of Electron-Phonon and Phonon-Phonon Interactions and Transport in Quantum Materials”
TF15+EM: Thin Films for Emerging Applications: Flexible Electronic, Pyroelectric, Phase Change, and  Other Functional Materials

TF16+BI: Vapor Deposition of Functional Polymer Thin Films
  • Malancha Gupta, University of Southern California
TF17+BI+EM: Vapor Deposition and Vapor Infiltration for Synthesizing Organic-Inorganic Hybrid Thin Films and Interfaces
  • Tamar Segal-Peretz, Technion – Israel Institute of Technology, Israel, "Sequential Infiltration Synthesis - From Design Rules to New Architectures of Metal Oxide Growth within Polymers"
TF18+EM: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials
  • Sriram Krishnamoorthy, University of Utah, "Metalorganic Vapor-phase Epitaxy of Gallium (Aluminum) Oxide Thin Films and Heterostructures for High Power and High Frequency Electronics"
TF19+2D+MI: Chalcogenide Materials and Applications

TF20+2D+EM: Low Dimensional Materials in Tunnelling Applications

TF21+2D+EM+MI: Thin Films for Quantum Computing
  • Dipanjan Mazumdar, Southern Illinois University, "Physical Properties of Binary Chalcogenide Thin Films Grown by Magnetron Sputtering"
TF22+AP: ALD and CVD for Nanostructured and High Aspect Ratio Materials
  • Neil P. Dasgupta, University of Michigan, Ann Arbor
TF23: Thin Film Poster Session
 

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Vacuum Technology (VT)

The Vacuum Technology Division provides a forum for research in achieving, maintaining, measuring, and analyzing vacuum or vacuum processes across a wide range of pressures, gas compositions, and applications.  The 2020 program includes the following topics: Vacuum Measurement; Vacuum Pumping; Large Vacuum Systems;  Accelerator;  Vacuum Quality Control. New topics, highlighted by special sessions, are entitled “Vacuum Technology for Quantum Applications,” “Next Generation Synchrotron Light Sources,” and “Fusion Research.” The poster session features the VT Student Poster Competition, where students of any discipline are invited to share their innovative solutions to vacuum equipment challenges. Student awards will also be given for the best oral presentations.

 
VT1: Vacuum Measurement, Partial Pressure, and Gas Analysis
  • Ute Bergner, VACOM, Vakuum Komponenten & Messtechnik GmbH, Germany, "Innovations in Gauges and Gas Analysis"
VT2: Vacuum Pumping and Extreme High Vacuum
  • Lucia Lain Amador, CERN, Switzerland, "Small Diameter NEG Coated Vacuum Chambers by Copper Electroforming"
VT3: Gas Dynamics, Modeling, and Simulation
  • Marton Ady, CERN, Switzerland, "SynRad and MolFlow for Vacuum Analysis of CERN"
VT4: Leaks, Flows, and Material Outgassing
  • Katharina Battes, Karlsruhe Institute of Technology (KIT), Germany, "Outgassing of Polymers for High Vacuum"
VT5: Aerospace and Large Vacuum System
  • Carl Brockmeyer, Leybold USA Inc., "Vacuum Technology of Hyperloop"
VT6: Vacuum Technology for Accelerators
  • Marc Ross, SLAC National Accelerator Laboratory, "LCLS-II HE Vacuum Design and Requirements"
VT7: Particle Control, Quality Control, Ultraclean Systems
  • Joshua Spradlin, Jefferson Lab, "Particulate and Contamination Control and Analysis at Jefferson Lab"
VT8: Vacuum Technology for Quantum applications
  • David Leibrandt, National Institute of Standards and Technology (NIST), "The NIST Quantum Logic Clock and its Vacuum Performance"
VT9+MI: Next Generation Synchrotron Light Source
  • Marek Grabski, Lund University, Sweden, "Next Generation Synchrotron Light Source"
VT10+PS: Vacuum Technology for Fusion Research
  • Christian Day, Karlsruhe Institut of Technology (KIT), Germany, "Vacuum Technology for Fusion Research"
  • Enrico Maccallini, SAES Getters, Italy, "Large Pumping Systems for Fusion Applications"
  • Robert Pearce, ITER Organization, France, "Vacuum Technology Development at the ITER Fusion Project"
  • Jorge Rocca, Colorado State University, "Innovations in Vacuum Technology for Fusion"
  • Charles Smith, US ITER, "Vacuum Development at US ITER Project"
VT11: Vacuum Technology Poster Session
 

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